| Summary: | 碩士 === 國立交通大學 === 電子工程系所 === 96 === In designing novel wireless communications devices, designers are facing a number of challenges such as standard evolution, market timing, system maintenance and even multi-technology integration. Also, as the performance requirement becomes higher, cross-layer operation plays an important role in modern systems. To accomplish various design goals, the MAC layer architecture should be elaborately defined. In this article, we present a modularized MAC architecture and its design guidelines. This architecture is based on a three-plane conceptual model, and enables quick prototyping, easy maintenance, efficient cross-layer signaling and potential multi-technology integration.
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