Enhancement of Metal-induced Lateral Crystallization Growth Rate by Rapid Thermal Annealing

碩士 === 國立交通大學 === 材料科學與工程系所 === 96 === Two annealing methods of fabricating low temperature poly Silicon(LTPS) thin film transistor (TFT) were discussed in this study.In order to achieve the low temperature process, we used metal-induced lateral crystallization(MILC) to fabricate it . Ni can lower t...

Full description

Bibliographic Details
Main Authors: Szu-Hsing Chung, 鍾思行
Other Authors: YewChung Sermon Wu
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/14096293610098534671
id ndltd-TW-096NCTU5159014
record_format oai_dc
spelling ndltd-TW-096NCTU51590142016-05-18T04:13:15Z http://ndltd.ncl.edu.tw/handle/14096293610098534671 Enhancement of Metal-induced Lateral Crystallization Growth Rate by Rapid Thermal Annealing 以快速熱退火法加強金屬側向誘發結晶速率之研究 Szu-Hsing Chung 鍾思行 碩士 國立交通大學 材料科學與工程系所 96 Two annealing methods of fabricating low temperature poly Silicon(LTPS) thin film transistor (TFT) were discussed in this study.In order to achieve the low temperature process, we used metal-induced lateral crystallization(MILC) to fabricate it . Ni can lower the temperature of process and annealing time because the reaction between Ni and Si of forming Nickel Disilicide(NiSi2) which lowers the annealing time in further process.In this experiment, the annealing were most achieved in rapid thermal annealing chamber(RTA), and several parameters were designed to change. The other annealing method is furnace annealing(FA). The samples fabricated by those ways would be compared in this research. YewChung Sermon Wu 吳耀銓 2007 學位論文 ; thesis 52 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立交通大學 === 材料科學與工程系所 === 96 === Two annealing methods of fabricating low temperature poly Silicon(LTPS) thin film transistor (TFT) were discussed in this study.In order to achieve the low temperature process, we used metal-induced lateral crystallization(MILC) to fabricate it . Ni can lower the temperature of process and annealing time because the reaction between Ni and Si of forming Nickel Disilicide(NiSi2) which lowers the annealing time in further process.In this experiment, the annealing were most achieved in rapid thermal annealing chamber(RTA), and several parameters were designed to change. The other annealing method is furnace annealing(FA). The samples fabricated by those ways would be compared in this research.
author2 YewChung Sermon Wu
author_facet YewChung Sermon Wu
Szu-Hsing Chung
鍾思行
author Szu-Hsing Chung
鍾思行
spellingShingle Szu-Hsing Chung
鍾思行
Enhancement of Metal-induced Lateral Crystallization Growth Rate by Rapid Thermal Annealing
author_sort Szu-Hsing Chung
title Enhancement of Metal-induced Lateral Crystallization Growth Rate by Rapid Thermal Annealing
title_short Enhancement of Metal-induced Lateral Crystallization Growth Rate by Rapid Thermal Annealing
title_full Enhancement of Metal-induced Lateral Crystallization Growth Rate by Rapid Thermal Annealing
title_fullStr Enhancement of Metal-induced Lateral Crystallization Growth Rate by Rapid Thermal Annealing
title_full_unstemmed Enhancement of Metal-induced Lateral Crystallization Growth Rate by Rapid Thermal Annealing
title_sort enhancement of metal-induced lateral crystallization growth rate by rapid thermal annealing
publishDate 2007
url http://ndltd.ncl.edu.tw/handle/14096293610098534671
work_keys_str_mv AT szuhsingchung enhancementofmetalinducedlateralcrystallizationgrowthratebyrapidthermalannealing
AT zhōngsīxíng enhancementofmetalinducedlateralcrystallizationgrowthratebyrapidthermalannealing
AT szuhsingchung yǐkuàisùrètuìhuǒfǎjiāqiángjīnshǔcèxiàngyòufājiéjīngsùlǜzhīyánjiū
AT zhōngsīxíng yǐkuàisùrètuìhuǒfǎjiāqiángjīnshǔcèxiàngyòufājiéjīngsùlǜzhīyánjiū
_version_ 1718270787969875968