Design and Fabrication of Probes for IC Testing Systems
碩士 === 國立交通大學 === 工學院碩士在職專班精密與自動化工程組 === 96 === The purpose of this theses for develop gold matrix composites for electrical contact alloy with high strength and high electrical conductivity. Experimental results reveal that we can use the transistor induction heating machine manufacturing gold elec...
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ndltd-TW-096NCTU51460062019-05-15T19:48:25Z http://ndltd.ncl.edu.tw/handle/8866bf Design and Fabrication of Probes for IC Testing Systems 半導體測試用高效能傳導元件之設計與製作 Yuan-chi Lin 林源記 碩士 國立交通大學 工學院碩士在職專班精密與自動化工程組 96 The purpose of this theses for develop gold matrix composites for electrical contact alloy with high strength and high electrical conductivity. Experimental results reveal that we can use the transistor induction heating machine manufacturing gold electrical contact alloy. Widespread the electrical contact alloy been used currently get in touch with the material as the copper(Cu) alloy material, this material the surface is easily born a oxidize copper film, get in touch with electric resistance to increase, that will cause the contact burn out easily. The gold (Au) has good anti-eclipse, ductility, high conductivity and stability, as long as can enhance its hardness and keep high electrical conductivity, can expand gold electrical contact's application. This research point is the manufacturing process control which aims at enhancing material and enhancing foundation, processing condition, procedure is main control parameters, Experimental results show at under appropriate manufacturing process condition, the hardness can reach to 377Hv, the electric resistance coefficient can reach to 15.68 μΩ.cm, reach practical standard. Tsung-lin Chen 陳宗麟 2007 學位論文 ; thesis 102 zh-TW |
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碩士 === 國立交通大學 === 工學院碩士在職專班精密與自動化工程組 === 96 === The purpose of this theses for develop gold matrix composites for electrical contact alloy with high strength and high electrical conductivity. Experimental results reveal that we can use the transistor induction heating machine manufacturing gold electrical contact alloy.
Widespread the electrical contact alloy been used currently get in touch with the material as the copper(Cu) alloy material, this material the surface is easily born a oxidize copper film, get in touch with electric resistance to increase, that will cause the contact burn out easily. The gold (Au) has good anti-eclipse, ductility, high conductivity and stability, as long as can enhance its hardness and keep high electrical conductivity, can expand gold electrical contact's application.
This research point is the manufacturing process control which aims at enhancing material and enhancing foundation, processing condition, procedure is main control parameters, Experimental results show at under appropriate manufacturing process condition, the hardness can reach to 377Hv, the electric resistance coefficient can reach to 15.68 μΩ.cm, reach practical standard.
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author2 |
Tsung-lin Chen |
author_facet |
Tsung-lin Chen Yuan-chi Lin 林源記 |
author |
Yuan-chi Lin 林源記 |
spellingShingle |
Yuan-chi Lin 林源記 Design and Fabrication of Probes for IC Testing Systems |
author_sort |
Yuan-chi Lin |
title |
Design and Fabrication of Probes for IC Testing Systems |
title_short |
Design and Fabrication of Probes for IC Testing Systems |
title_full |
Design and Fabrication of Probes for IC Testing Systems |
title_fullStr |
Design and Fabrication of Probes for IC Testing Systems |
title_full_unstemmed |
Design and Fabrication of Probes for IC Testing Systems |
title_sort |
design and fabrication of probes for ic testing systems |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/8866bf |
work_keys_str_mv |
AT yuanchilin designandfabricationofprobesforictestingsystems AT línyuánjì designandfabricationofprobesforictestingsystems AT yuanchilin bàndǎotǐcèshìyònggāoxiàonéngchuándǎoyuánjiànzhīshèjìyǔzhìzuò AT línyuánjì bàndǎotǐcèshìyònggāoxiàonéngchuándǎoyuánjiànzhīshèjìyǔzhìzuò |
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1719094680958795776 |