Effect of Indium Addition on the Microstructure Evolution and Adhersive Strength of Sn-Ag-Sb Lead-Free Solder Joints
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 96 === This research are to evaluate the effects of 1~5wt.% Indium additions on microstructure, hardness and interfacial reaction with Cu substrate of Sn-2Ag-3Ag(SAS) lead-free Solder alloys. Tensile and thermal storage tests were used to estimate the adhesive streng...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87066268733516332989 |