Numerical Simulation and Process Parameter Study for Chemical Mechanical Planarization
博士 === 國立成功大學 === 機械工程學系碩博士班 === 96 === Chemical mechanical planarization (CMP) has played an enabling role in producing near-perfect planarity of interconnection and metal layers in ultra-large scale integrated (ULSI) devices. During CMP, a rotating wafer is pressed against a rotating pad, while a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06283620586072910680 |