Preparation of the electroplating resist for NTC thermistors

碩士 === 國立成功大學 === 資源工程學系碩博士班 === 96 ===   Owing to the prevalence of portable electronic device in recent years, the development of electronic components trends towards thinner, smaller and much surface adherent. It turns out to ferment the demand for NTC thermistor. When producing NTC termination e...

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Main Authors: Yi-hung Lin, 林奕宏
Other Authors: Hsing-I Hsiang
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/19116520137648605194
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spelling ndltd-TW-096NCKU53970932015-11-23T04:03:10Z http://ndltd.ncl.edu.tw/handle/19116520137648605194 Preparation of the electroplating resist for NTC thermistors 負溫度係數熱敏電阻電鍍保護層之製作 Yi-hung Lin 林奕宏 碩士 國立成功大學 資源工程學系碩博士班 96   Owing to the prevalence of portable electronic device in recent years, the development of electronic components trends towards thinner, smaller and much surface adherent. It turns out to ferment the demand for NTC thermistor. When producing NTC termination electrodes, in order to enhance the solder property, we have to 1) attach silver electrodes to components about 40~50μm thickness, 2) co-fire in 600℃∼650℃, and finally 3)coat Ni-layer with 2∼4μm thickness and Sn- or Sn-Pb layer with 5∼10μm thickness. However, NTC thermistor is of semiconducting ceramics, resulting in the diffusion phenomenon in electroplate layer during electroplating.   In this research, on the surface of NTC thermistor, we employ phosphate ion conversion treatment, by the reaction of phosphate ion and (Co,Mn)(Mn,Co)2O4, to construct manganese phosphating protection layer, which is resistance and defending for the corrosion due to electroplate liquid. Moreover, we also investigate 1) the effect with respect to the variation of sorts of accelerator and the variation of accelerator concentration, and 2) the influence on the surface structure and material property of manganese phosphating layer by changing temperature and time of conversion treatment. In consequence, on the surface of NTC thermistor, ideal MnPO4•H2O layer can be constructed by 1) utilizing the solution of manganese phosphating as the conversion treatment liquid in which Zn+2 ions are added as accelerator, and by 2) 90℃ and 1 hour conversion treatment. The mechanism of layer producing is in that 1) first the Mn-rich region in the composition of NTC thermistor is dissolved, 2) Mn+3 ions from manganese phosphating solution thus react with PO43- ions within the solutions, and 3) finally the Ni-rich region in the composition of NTC thermistor precipitates MnPO4•H2O, forming the manganese phosphating layer. Hsing-I Hsiang 向性一 2008 學位論文 ; thesis 66 zh-TW
collection NDLTD
language zh-TW
format Others
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description 碩士 === 國立成功大學 === 資源工程學系碩博士班 === 96 ===   Owing to the prevalence of portable electronic device in recent years, the development of electronic components trends towards thinner, smaller and much surface adherent. It turns out to ferment the demand for NTC thermistor. When producing NTC termination electrodes, in order to enhance the solder property, we have to 1) attach silver electrodes to components about 40~50μm thickness, 2) co-fire in 600℃∼650℃, and finally 3)coat Ni-layer with 2∼4μm thickness and Sn- or Sn-Pb layer with 5∼10μm thickness. However, NTC thermistor is of semiconducting ceramics, resulting in the diffusion phenomenon in electroplate layer during electroplating.   In this research, on the surface of NTC thermistor, we employ phosphate ion conversion treatment, by the reaction of phosphate ion and (Co,Mn)(Mn,Co)2O4, to construct manganese phosphating protection layer, which is resistance and defending for the corrosion due to electroplate liquid. Moreover, we also investigate 1) the effect with respect to the variation of sorts of accelerator and the variation of accelerator concentration, and 2) the influence on the surface structure and material property of manganese phosphating layer by changing temperature and time of conversion treatment. In consequence, on the surface of NTC thermistor, ideal MnPO4•H2O layer can be constructed by 1) utilizing the solution of manganese phosphating as the conversion treatment liquid in which Zn+2 ions are added as accelerator, and by 2) 90℃ and 1 hour conversion treatment. The mechanism of layer producing is in that 1) first the Mn-rich region in the composition of NTC thermistor is dissolved, 2) Mn+3 ions from manganese phosphating solution thus react with PO43- ions within the solutions, and 3) finally the Ni-rich region in the composition of NTC thermistor precipitates MnPO4•H2O, forming the manganese phosphating layer.
author2 Hsing-I Hsiang
author_facet Hsing-I Hsiang
Yi-hung Lin
林奕宏
author Yi-hung Lin
林奕宏
spellingShingle Yi-hung Lin
林奕宏
Preparation of the electroplating resist for NTC thermistors
author_sort Yi-hung Lin
title Preparation of the electroplating resist for NTC thermistors
title_short Preparation of the electroplating resist for NTC thermistors
title_full Preparation of the electroplating resist for NTC thermistors
title_fullStr Preparation of the electroplating resist for NTC thermistors
title_full_unstemmed Preparation of the electroplating resist for NTC thermistors
title_sort preparation of the electroplating resist for ntc thermistors
publishDate 2008
url http://ndltd.ncl.edu.tw/handle/19116520137648605194
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