Investigation of Micro-Thermoforming Process Using Silicon Mold Fabricated by Deep Reactive Ion Etching

• Main Authors: Ying-ming Wang, 王英名
• Other Authors: Yi-je Juang
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/22665765567902674074

碩士 === 國立成功大學 === 化學工程學系碩博士班 === 96 === In this study, we investigated the micro-thermoforming process for fabrication of polymeric thin film microstructures using silicon molds. The silicon molds with high aspect ratio microstructures (HARMs) were fabricated via inductive coupled plasma-reactive ion etching (ICP-RIE) process. The polymeric thin films with two different thicknesses were used and various processing conditions such as film temperature, applied pressure and thermoforming time were discussed. The result showed that the silicon molds with and without the through holes were constructed and the aspect ratio of the microstructures ranges from 1.7 to 24.6. For the molds without through holes, black silicon was formed at the bottom of the microstructures when the line width is larger than 50μm, which can be effectively removed by O2 plasma treatment. As to the thermoforming process, higher applied pressure, higher film temperature and longer thermoforming time will facilitate fabrication of polymeric thin film with microstructures; however, due to the limitation of the equipment/device, higher applied pressure, higher film temperature and longer thermoforming time may cause film broken at the locations where the film being clamped and pre-stretched during thermoforming process. Utilizing the thermoforming process, we were able to obtain the polymeric thin film with microstructures having aspect ratio ranging from 0.44 to 2.53. The mathematical equation describing the relationship between the depth and the film thickness of the thermoformed film for conventional thermoforming process was modified and a reasonably well agreement between calculation and experimental results was obtained.