Shear and Normal Adhesion Force Test Mold Design and Study
碩士 === 國立成功大學 === 工程科學系碩博士班 === 96 === During the encapsulation process of IC packages, epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occur in the interface between mold surface, substrate, leadframe and EMC. An excessive adhesion force may damage an...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49588311171440799680 |