| Summary: | 碩士 === 國立成功大學 === 工程科學系碩博士班 === 96 === During the encapsulation process of IC packages, epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occur in the interface between mold surface, substrate, leadframe and EMC. An excessive adhesion force may damage an IC product during ejection and cause the package to fail and decrease the product quality and reliability. But adhesive effects are good for leadframe and substrate, because the larger adhesion force is the better reliability product can have. So this research was aimed to measure the exact values and find out the methodology to improve the quality of the products.
This research used a semi-automatic EMC adhesion force test instrument that had been developed and fabricated before. Different mold designs were used to decrease the EMC overflow in order to measure the exact normal adhesion force, and to improve the stability of test instrument.
After the test, when the newly designed mold was closed, the Top Tool would slightly touch Middle Plate Tool. The standard deviation of experiment data was found to decrease after mold modification.
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