A Novel Modified Global/Local Approach using the Concept of Optimal Equivalent Solder for Fatigue Reliability Optimization of Stacked Chip BGA Packaging Systems
博士 === 國立成功大學 === 工程科學系碩博士班 === 96 === A stacked die package consists of a plurality of chips stacked up one over another for the purposes of reducing occupied space, enhancing functional speed, lowering power dissipation, miniaturizing the structure, and consequently cutting down the costs of the e...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13405859753850725218 |