Studies of Convection Effect on Microvia Filling over Copper Electroplating

Studies of Convection Effect on Microvia Filling over Copper Electroplating

碩士 === 國立中興大學 === 化學工程學系所 === 96 ===

Bibliographic Details
Main Authors:	Sian-Zong Liao, 廖顯宗
Other Authors:	竇維平
Format:	Others
Language:	zh-TW
Published:	2008
Online Access:	http://ndltd.ncl.edu.tw/handle/69699142642537291186

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