Studies of Convection Effect on Microvia Filling over Copper Electroplating

碩士 === 國立中興大學 === 化學工程學系所 === 96 ===

Bibliographic Details
Main Authors:	Sian-Zong Liao, 廖顯宗
Other Authors:	竇維平
Format:	Others
Language:	zh-TW
Published:	2008
Online Access:	http://ndltd.ncl.edu.tw/handle/69699142642537291186

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spelling	ndltd-TW-096NCHU50630312016-05-09T04:13:40Z http://ndltd.ncl.edu.tw/handle/69699142642537291186 Studies of Convection Effect on Microvia Filling over Copper Electroplating 對流效應對於電鍍銅填塞微米級盲孔之研究 Sian-Zong Liao 廖顯宗碩士國立中興大學化學工程學系所 96 竇維平 2008 學位論文 ; thesis 130 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立中興大學 === 化學工程學系所 === 96 ===
author2	竇維平
author_facet	竇維平 Sian-Zong Liao 廖顯宗
author	Sian-Zong Liao 廖顯宗
spellingShingle	Sian-Zong Liao 廖顯宗 Studies of Convection Effect on Microvia Filling over Copper Electroplating
author_sort	Sian-Zong Liao
title	Studies of Convection Effect on Microvia Filling over Copper Electroplating
title_short	Studies of Convection Effect on Microvia Filling over Copper Electroplating
title_full	Studies of Convection Effect on Microvia Filling over Copper Electroplating
title_fullStr	Studies of Convection Effect on Microvia Filling over Copper Electroplating
title_full_unstemmed	Studies of Convection Effect on Microvia Filling over Copper Electroplating
title_sort	studies of convection effect on microvia filling over copper electroplating
publishDate	2008
url	http://ndltd.ncl.edu.tw/handle/69699142642537291186
work_keys_str_mv	AT sianzongliao studiesofconvectioneffectonmicroviafillingovercopperelectroplating AT liàoxiǎnzōng studiesofconvectioneffectonmicroviafillingovercopperelectroplating AT sianzongliao duìliúxiàoyīngduìyúdiàndùtóngtiánsāiwēimǐjímángkǒngzhīyánjiū AT liàoxiǎnzōng duìliúxiàoyīngduìyúdiàndùtóngtiánsāiwēimǐjímángkǒngzhīyánjiū
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Studies of Convection Effect on Microvia Filling over Copper Electroplating

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