Analysis of Device Integrity with Micro-Cleaving Technology in Advanced Copper Process
碩士 === 明新科技大學 === 電子工程研究所 === 96 === Through the quick development in process technology, the semiconductor devices are gradually smaller. Furthermore, the width of metal lines is more and more narrow and the number of metal layers is increased more. Every fabrication company is trying to search mor...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83874521010753102321 |