| Summary: | 碩士 === 高苑科技大學 === 電子工程研究所 === 96 === To date, microchannel fabrication mostly still used LIGA-like, sacrificial layer, and reactive ion etch technologies. These fabrication technologies have co-disadvantages “spend too much time”, and also need higher environment controlled, accurate devices, and cost more expensive. In view of this, we used YAG laser technology to fabricated microchannel in this study, which have fast processing, low contamination, low cost, and simple fabrication process.
The YAG laser surface treating technology have used to fabrication of microchannel on silicon wafer. The effect of frequency, current intensity and scanning speed parameters on microchannel’s width and depth and microstructures have been investigated. The experimental results showed that the spot’s diameter was decreased as the frequency increasing, but the spot’s diameter was increased as the current increasing. Microchannel width is directly depending on spot’s diameter. The depth of the microchannel is affected on frequency, current intensity and scanning speed. The effect of heat affect zone of microchannel is not obviously different in each experimental parameter. The roughness of the microchannel was increased as the frequency and current increasing, but decreased as the scanning speed increasing. In this study, the optimal parameter of experiment is scanning speed 10mm/s, current intensity 10A, and frequency 1KHz.
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