| Summary: | 碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 96 === In recent years, numerical analysis of finite element method is widely used in metal forming. Simulation analysis was confirmed to be a very useful tool in the design stage. The goal of this research is to design a new evaporator for nitrogen liquid for semiconductor usage which is composed of aluminum tube and stainless pipe. The mechanical tests, such as macro etching, tensile test and hole-expansion test, were used to verify the strength of seam aluminum tube. From experiments, these tubes did not break. It means that they have sufficient strength at welding line.
Two engineering analysis software (DEFORM 2D and 3D) were used for simulating the extrusion of aluminum seam tube and rolling process for gap closing of aluminum tube and stainless pipe. Most important issues related to metal forming process, such as stress, strain and gap closing mechanism were studied. Through the locking process simulation of two-part fins, although the assembly process has been completed, gaps happened. These gaps will result in ice phenomenon which become thermal resistance of evaporator. It further reduces the efficiency of thermal conductivity. Modification design becomes a single piece of aluminum fin tube coming from hot hollow extrusion process. Through DEFORM simulation of extrusion process, several issues were studied, such as stress concentration of extrusion die and flow pattern of extrude aluminum part. An aluminum fin tube with more than 6 meter long has been successfully extruded in factory.
Further, a roll forming mechanism was designed to make sure the gap will close after stainless pipe inserted into aluminum fin tube to produce an IC-level evaporator of hydrogen liquid.
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