Development of a Thick Film Process Technology for Micro Linkage Mechanism Fabrication

• Main Authors: Tzung-Sheng Chen, 陳宗聖
• Other Authors: Da-Cheng Pang
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/33005989014511598988

碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 96 === This research proposes a novel fabrication method for polymer-based micro linkage mechanism using thick film process. The method applies metal mask layer, anti-reflection layer and sacrificial layer so the linkage can be made without assembly. The polymer-based micro linkage comparing to silicon-based material has advantages of low temperature fabrication process and cheap material cost. The first step of the method is to electroform copper on the conducing layer as a sacrificial layer. The photoresist SU-8 is spin-coated on the top and exposured with linkage structure. The anti-reflection layer is applied before the metal mask layer is sputtered. The metal mask layer is patterned and electroformed so it is used as gap between linkage and shaft as well as spacer between two layers. Similar steps are continued until the whole mechanism structure is stacked. Finally, the photoresists and metal are removed altogether so the micro linkage is completed. A polymer-based micro four-bar linkage has been successfully designed, fabricated and tested. In the future, the micro linkage integrated with a reluctance motor can be used in micro optical system, micro robot, and other applications.