The high speed electronic connector design of PRO-E and SPICELINK simulation

• Main Authors: Wu Hsien Feng, 吳憲鋒
• Other Authors: Bin-Yih Liao
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/76547143438329219135

碩士 === 國立高雄應用科技大學 === 電子與資訊工程研究所碩士班 === 96 === Our paper proposed a complete design method for high speed circuit. It includes basic theory, 3D painting software, the practice in circuit drawing with Pro/Engineer Wildfire 2.0, the practice of connectors simulation with Maxwell Spicelink 4.5, and the practice and basic theory of time domain reflectometry (TDR). With measurement by TDR and resistance fetching according to connection wire characteristic, the parameter of high speed connection component is obtained. At first, the effect between the connection components in high speed digital system is discussed with, and how to measure by TDR would be concerned. According to the method to fetch the resistance of connection components characteristic, the parameter of tested connection components would be calculated. At the mean time, the model of wire or equivalent circuit in tested object would be established by using the formula of resistance. According to the analysis of real component simulated by IPA510 and Spice, the correctness of developed measurement and algorithm is confirmed.