Using Multi-Wall Carbon Nanotube to Improve Thermal Conductivity of Die Bonding Interface in High-Power Blue Light-Emitting Diode

• Main Authors: Yu-Chuan Chen, 陳育專
• Other Authors: Chun-Liang Lin
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/6cm772

碩士 === 崑山科技大學 === 電子工程研究所 === 96 === Light-emitting diodes (LED) for the 20th World remember one of the greatest inventions, spare LED replace the traditional light source shorten the time to substantially raise output brightness, while enhancing the current at the same time, the heat has become a key technology, excessive heat serious impact on light-emitting diode life and luminous efficiency and lead to encapsulating resin yellow and brittle fracture of phosphor powder drift. In this studies, we have used multi-walled carbon nanotubes (MWCNT) with high thermal conductivity as high as 3000~6000W/mK MWCNT, doped silicon oxygen in the high degree of transparency resin (Silicone), for 40 mil2 high-power blue LED-crystal (Die Bonding), compared with the modern use of pure silicon resin, LED difference between optical and electrical properties, and analysis of the physical properties of materials, and further improvements. Because Van der Waals'' forces MWCNT are like a cluster, we are against this is like, analysis of the literature distributed, then the use of nitric acid purification and graft modified form, similar to absorb MWCNTs were dispersed Oxygen in silicone resin, making MWCNT to the merit of the show. Experiments show that doping MWCNT in drive current 350mA high-power LED, can upgrade the traditional die attach resin thermal conductivity of up to 10% and to reduce the chip to lead frame interface thermal resistance, To effectively improve LED dissipate heat, but also indirectly measured, lower junction temperature will reduce the optical and electrical properties change.