Reliability Analysis and Temperature Cycling Test for System-in-Package(SiP)
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 96 === Due to high I/O pin counts and complicate geometry, System-in Package (SiP) has been the most popular package styles in the IC industries in the past decade. Because of mismatch of the coefficients of thermal expansion (CTE) of the components, many thermal st...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/53608502630297206749 |