Thermal Deformations and Stress Distributions of Flip-Chip BGA Package under Thermal Environment
碩士 === 逢甲大學 === 機械工程學所 === 96 === Following the market demands and progress of science and technology, the development of consuming and portable electronics tend to become small, light, and multi-functional for recent years. For these requirements, flip chip technology has become popular rapidly owi...
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37495069798518527661 |