Clean Method of Evaluation of Assembly Product

• Main Authors: CHIH-FAN YEN, 葉鋕凡
• Other Authors: Chin-An Lin
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/57314438719527335705

碩士 === 逢甲大學 === 紡織工程所 === 96 === In this study、have uses four kinds of different solvents (Pure water, washing powder solvent, soap 、the washing powder solvent adds dishwashing liquid) 、and match different washing conditions separately (Different temperatures、different washing time)、and perform the flux clean experience for semiconductor product (0.45mm Sn96.5/Ag3.0/ u0.5 (SAC305). And analysis by Visual Contact Angle Analyzer、EDX、 microscope when after flux clean、And is probed into uses the differently solvent、the clean ability of flux residue. and the experimental result showed、not only washing solvent has influence for the clean ability but the water temperature and washing time also have the direct relations. so the residue flux issue for reliability of semiconductor product、is one heavy key factors.