Surface Treatment Effect of IC Package Mold on the Formation of Green Compound

Surface Treatment Effect of IC Package Mold on the Formation of Green Compound

碩士 === 逢甲大學 === 材料與製造工程所 === 96 === none

Bibliographic Details
Main Authors: TZU-SHAN LIN, 林子善
Other Authors: Chung-Li Hwan
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/93949862009988363553
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spelling ndltd-TW-096FCU051590412015-11-27T04:04:43Z http://ndltd.ncl.edu.tw/handle/93949862009988363553 Surface Treatment Effect of IC Package Mold on the Formation of Green Compound IC封裝模具表面處理對環保樹脂複合物成形之效應 TZU-SHAN LIN 林子善 碩士 逢甲大學 材料與製造工程所 96 none Chung-Li Hwan 黃宗立 2008 學位論文 ; thesis 69 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 逢甲大學 === 材料與製造工程所 === 96 === none
author2 Chung-Li Hwan
author_facet Chung-Li Hwan
TZU-SHAN LIN
林子善
author TZU-SHAN LIN
林子善
spellingShingle TZU-SHAN LIN
林子善
Surface Treatment Effect of IC Package Mold on the Formation of Green Compound
author_sort TZU-SHAN LIN
title Surface Treatment Effect of IC Package Mold on the Formation of Green Compound
title_short Surface Treatment Effect of IC Package Mold on the Formation of Green Compound
title_full Surface Treatment Effect of IC Package Mold on the Formation of Green Compound
title_fullStr Surface Treatment Effect of IC Package Mold on the Formation of Green Compound
title_full_unstemmed Surface Treatment Effect of IC Package Mold on the Formation of Green Compound
title_sort surface treatment effect of ic package mold on the formation of green compound
publishDate 2008
url http://ndltd.ncl.edu.tw/handle/93949862009988363553
work_keys_str_mv AT tzushanlin surfacetreatmenteffectoficpackagemoldontheformationofgreencompound
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