The Optimal Parameter Setting for Nicked-Plating Process of Lead Frame for Semiconductor Industry-Case Study by Lead Frame Supplier A Company
碩士 === 朝陽科技大學 === 工業工程與管理系碩士班 === 96 === Recently consumer electronic products are prospered and bring semiconductor industry into a new decade. The two main components of semiconductor industry are Integrated Circuit and Lead Frame. This research focuses on the production process of Lead Frame. Lea...
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fuey3c |
| Summary: | 碩士 === 朝陽科技大學 === 工業工程與管理系碩士班 === 96 === Recently consumer electronic products are prospered and bring semiconductor industry into a new decade. The two main components of semiconductor industry are Integrated Circuit and Lead Frame. This research focuses on the production process of Lead Frame. Lead Frame can perform the function of transmitting the Integrated Circuit’s signal after it is electroplated by a layer of metal materials. The main objective of this research is to find the optimal parameters for the manufacturing process to stabilize and reduce the thickness of Nickel-Plating of Lead Frame.
This research first conducts the Two-Level full factorial experiment design with six center points and then uses the Center Composite Design of response surface method to find the optimal range of parameter setting for the Nickel-Plating process. Subsequently, we apply the obtained optimal parameter to the production line of the electroplating process to examine that the index of process capability has increased or not with these new optimal parameters.
The main result of this research is to provide a standard procedure to search the optimal parameter setting of Nickel-Plating process for the electroplating industry. With this optimizing procedure, we can help the electroplating industry to improve the product quality and thus to increase the competitiveness of their products.
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