Optimized Design of Pin-Shaped Structure for Flip Chip Packaging
碩士 === 中原大學 === 機械工程研究所 === 96 === This investigation describes about the effect of different shape solder ball on stress in flip chip packaging. The stress developed in then used to evaluate the fatigue life. ANSYS has been implemented to study the von Mises stress an Shear strain behavior and fati...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02250809343553569645 |