Improvement of PECVD Chamber Clean Efficiency Using NF3-Based Remote Plasma
碩士 === 中原大學 === 化學工程研究所 === 96 === Plasma-enhanced chemical vapor deposition of silicon-based film is typically used in applications such as isolation layers, dielectric layers or passivation of TFT and IC. In these CVD processes, amorphous silicon, silicon nitride and silicon oxide are deposited no...
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74299655659612607399 |