| Summary: | 碩士 === 長庚大學 === 機械工程研究所 === 96 === Abstract
Conventional process for producing nano-particles involve mechanical grind, laser ablation, metal vapor synthesis reaction and chemical reduction methods. There are various limitations in aforementioned methods. Among the various production methods, chemical reduction method is the most promising and thus has been widely investigated because it produces particles of high purity, great quantity and low cost.
In this study, the copper nano-particles were electroplated on the titanium substrate from copper sulphate solution. Growth morphology and crystal size of the deposit particles were examined with scanning electron microscope (SEM) and Optimas analyses. The effects of different electrodeposition overpotional on the growth of copper particle were studies. Potentionsatic electroplating and pulse electroplating were further applied to the copper particles with electroplating parameters, such as potential, bath temperature, rotation speed, additive concentration.
Results of cathodic polarization and potenionsatic plating experiments show that the increasing temperature, rotation speed in the plating bath would significantly increase the catholic potential. Deposits ranging from isolated particles to dense arrays of nano- dimension particles have been formed. For example, by using potentionsatic plating at -1200 mV, 0.1 sec, 25℃, 600 rpm；a high particle density and a mean particle size of 265 nm were obtained.
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