A Study of Implementing Radio Frequency Identification into DRAM Packaging Testing by Using Morphological Analysis

碩士 === 長庚大學 === 企業管理研究所 === 96 === In the decades, the global Dynamic Random Access Memory (DRAM) semiconductor industry, especially DRAM packaging and testing industry, has been facing the trend of meager profits due to highly standardization, mature production process and obvious business boom cyc...

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Bibliographic Details
Main Authors: Hung Che Lee, 李宏哲
Other Authors: H. M. Wang
Format: Others
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/36494633154336779103