Thermal Effects on the Fatigue Life of FCBGA Component under Cyclic Bend Test
碩士 === 元智大學 === 機械工程學系 === 95 === In this study, the temperature effect on the reliability of the Flip Chip Ball Grid Array (FCBGA) component is investigated through combining experiment, finite element analysis (FEA) and the theoretical fatigue life calculation. The four-point bend test is conduct...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34952501896802894867 |