AGENT TECHNOLOGY TRANSFER STRATEGY ON SUPPLY CHAIN INTEGRATION：A CASE OF SYSTEM-IN-PACKAGE (SiP) TECHNOLOGY

• Main Authors: Chi-Meng Shen, 沈基盟
• Other Authors: Chien-Te Ho
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/03979399402336499222

碩士 === 元智大學 === 管理研究所 === 95 === Due to the raise of needs in consumer communication products and intensive rivalry in the electronic industry, the speed of product renewal in the market is a key to success. While accuracy and easy production is fundamental to the industry, the capability to select good equipment and right process technologies is an important part to manufacturing planning. In the beginning of electrics industry in Taiwan, due to limited market and production technology, equipment and production technologies relied on foreign vendors or their agents. Now, Although Taiwan has become a global electric industry base, China, with the advantage of cheap labor and production factors, becomes main competitor to Taiwan. As production technologies for communication products advance, lowing cost, increasing yield, and raise output value are challenge for electric industry. If an equipment agent cannot offer new process or improve old process, the agent possibly encounters challenges from customer, competitor or its partner vendor. Base on these reasons, an equipment agent must develops own technology or cooperate with the vender to transfer technology to end user. It is agent’s core value added to the equipment sales and services process.. Semiconductor is the basic of electric industry. Semiconductor to the electronic industry is as food to human. Among the technologies, Surface Mount Technology (SMT) is the one that make the industry flourish. Reviewing the developing paths of SMT and semiconductor technologies, it is found that the two are complimentary to each other. However, technological interchanges between the these two fields have been less reported. Few cases were technology transfer from semiconductor industry to SMT industry but transfer from the reverse direction is not found yet. Because the semiconductor industry has relatively higher output value than the SMT industry, semiconductor industry demands for higher yield rate. Additionally, increasing production capacity is another issue for the semiconductor industry owing to the expanding range of competition in the electronic industry. As a result, technology transfer for the above purposes is the task for equipment agents. On the other hand, if equipment agents fail to conduct successful technology transfers, not only the equipment suppliers can not obtain necessary technologies but also losing market opportunities. For all these reasons, this research studies the technology transfer at system level of semiconductor packaging and uses the System-in-Package (SiP) technololgy as a case. It aims to explore the equipment agent’s strategy on integrating semiconductor packaging and SMT technologies. Technological barriers, costs and process of the transfer process are discussed from the equipment agent’s standpoint and reported in this thesis.