The Layout Planning Problem of the Array Process at TFT-LCD Plant-The Case of T Company

• Main Authors: Hui-ju Lu, 呂蕙如
• Other Authors: 胡黃德
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/19831987330117795763

碩士 === 元智大學 === 工業工程與管理學系 === 95 === The 5 major mask processes in TFT-LCD Array Manufacturing Process are Gate Electrode (GE)、Semiconductor Electrode (SE) 、Source Drain Electrode (SD)、 Contact Hold (CH) and Pixel Electrode (PE) processes which all repeat the sub-process of thin-film developing、photo transferring、etching and stripping process. Each of the ordinary flat glass panel must process through the sub-process for 5 times to fabricate the TFT-LCD Display Panel. The manufacturing process layout becomes a key point because of the increasing manufacturing complexity and the characteristic of manufacturing process re-flowing. The original TFT-LCD Array process was “Functional flow layout”, after a long-term operation it produced a great amount of overlapped process and the flows material turn un-smoothed. In order to improvement the circumstances, the manufacturing facility layout plan to re-design and re-arrange. To achieve the goal of minimum facility moving path, the similar working processes group together and re-annarge the path according to the dispatching rule. The outline of the new dispatching path is like an Arabic number “8” so name the method “8 Style Layout”. Furthermore, combining “8 Style Layout” with “Functional Group Layout” forms the “Group+8 Style Layout”. This research plan to analyze the difference between the former “Function layout” method with the improved“Group+8 Style Layout” method under the condition of same facility layout space and the same numbers of manufacturing machines in the T Company by computing the total facility dispatching distance、the numbers of moving equipments、the cycle time of each production lot and the quantities of the WIP. The result reveals that the “Group+8 Style Layout” could eliminate an RGV robot、reduce 36 seconds /lot of each production cycle time and decrease the 0.008% WIP Inventory .