| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 95 === This research is to improve the second generation of mold cavity pressure sensor which was made by oneself and a new pressure sensor is designed, in this paper, which are called the third generation pressure sensor, the fourth generation pressure sensor and the fifth generation pressure sensor . There are three shortcomings in the second generation of pressures sensor: First, in the working environment is tested, when rising hurriedly in pressure, because the strength of structure is insufficient so the piezocrystal is easy to crack. Second, insulation is bad, it is easy to the short circuit and lose function. Third, the machining accuracy is insufficient, it is unstable to cause the response of the piezocrystal. To three disappearances, in this study, the structure of piezocrystal is improved as follows：Utilize insulation of ceramics and rigidity is strong to as the piezocrystal structure. Utilize insulation of the Teflon and its high-temperature characteristic, combine the spring to buffer, prevent the piezocrystal structure from shorting out, cracking and malfunctioning. Utilize the Teflon to make the piezocrystal structure，combine with the spring washer as the inside structure of the pressure sensor to protect the pressure sensor. The third generation pressure sensor , the fourth generation pressure sensor and the fifth generation pressure sensor both do the static, dynamic analysis of structural mechanics, including the working stress analysis of pressure sensor , the relation that the pressure corresponds with what the voltage outputs in the mold, natural frequency, modal shape and transient analysis. It is known by the analysis result that theirs mechanical characteristic are fine, the third generation pressure sensor make test result to be good , the fourth generation pressure sensor and the fifth generation pressure sensor are only analyzed, according to the analysis, natural frequency can reach 1.7kHz and 10 kHz, it can promote the range of working frequency while survey pressure.
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