| Summary: | 碩士 === 國立臺北科技大學 === 有機高分子研究所 === 95 === Due to the rapid development of microelectronic systems, faster signal speed and smaller size are currently requested. To achieve those, a good quality of printed circuit board (PCB) is required, such as mechanical stability, high thermal stability and moisture inertness. Common used epoxy based PCB has not been satisfied due to the thermal stability issue. Therefore, to develop high performance material is very important.
To modify the PCB property, Polybenzoxazine is a good chose of curing agent due to its good physical and mechanical properties better than epoxy resin such as high glass transition temperature (Tg), low moisture absorption , good dimension stability、good electrical properties etc. In this work, a series of modified polybenzoxazine contained different chain length aliphatic group have synthesized and analyzed. Finally, PCB boards made from these synthesized polybenzoxazine and epoxy resin have been fabricated and showed better thermal and mechanical stability.
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