The Research About Microetching Efficiency in Different Parameters and Methods of Sulfuric Acid and Hydrogen Peroxide

• Main Authors: Li-Chin Chiang, 姜禮欽
• Other Authors: 段葉芳
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/xcj62d

碩士 === 國立臺北科技大學 === 化學工程研究所 === 95 === The copper surfaces in manufacture printed wiring boards are coated with various kinds of organic films such as etch resists, plating resists, dielectric materials and solder masks. Whether these films are liquid forms or solid films, what we want is to create a secure bond to the copper surface. These experiments are designed to study the etching amount of copper surface in different parameters of acid. The research has three parts. The first part is to discuss the etching amount in the dip etching. The second part is to discuss the etching amount on machine experiment. The third part is to discuss the edge surface after dip etching and machine experiment. In dip etching experiments, we discover that etching amount is effected by temperature, Hydrogen Peroxide, copper and inhibitor but not sulfuric acid. And the etching amount rises as temperature, Hydrogen Peroxide and inhibitor rises but copper content is reverse. In machine experiments, we find that the etching amount rises as temperature rises but pressure and etching time are no obvious effects. In the edge surface, we find that surface roughness in machine experiment is better then dip etching.