Effects of Boundary Conditions on Misalignment and Residual Stress for Flip Chip Bonding
碩士 === 南台科技大學 === 機械工程系 === 96 === Abstract Recently the demand for hand-held devices not only requires small size but also flexible property, which makes the amount of packaging IC on a flexible substrate rapidly increases nowadays. During the thermal cycle as packaging, the thermal expansion o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43052177830322191042 |