Design of Miniaturized Multi-Band Chip Antenna

• Main Authors: Jen-hsiang Li, 李仁翔
• Other Authors: Chang-Fa Yang
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/v35pv5

碩士 === 國立臺灣科技大學 === 電機工程系 === 95 === Abstract This thesis apply HFSS to design and analyze miniaturize chip antennas. Simulate an Insert Molding Technology is employed to manufacture the chip antennas, where the radiating structure of the antenna is fabricated on a substrate and composite dielectric material is attached by applying the Insert Molding Technology to form the chip antenna. Compared with a more popular Low Temperature Co-firing Ceramic Technology, our approach has the advantages of smaller technology barrier, lower cost, better design flexibility and higher production yield, very suitable for manufacturing the chip antennas. In this study, The low band include GSM band and high band include DCS,PCS,3G with HSDPA for miniaturize chip antenna with a volume of 22×21.6×0.8mm3 has been designed and fabricated. Then, return loss and far-field radiation patterns of the chip antenna have been measured. Good agreements between measurements and HFSS simulations are obtained, which verify the program simulations. Also, the antenna radiation patterns indicate that the efficiency of the chip antenna is very good. Furthermore, the tiny chip antennas have been applied to WLAN cards to analyze and evaluate how they work in practice. Also, simulations and measurements have been performed to study the effects due to the dielectric constant and the thickness of the molding material, and required empty area on the cards. Thus, the properties of the chip antennas may be understood and handled more comprehensively.