Study of Patent Innovation Mechanism for End Point Detection of Chemical and Mechanical Polishing

碩士 === 國立臺灣科技大學 === 自動化及控制研究所 === 95 === This paper is to develop a patent innovation mechanism for end point detection of chemical and mechanical polishing. It can help users to create innovated patents in the field of end point detection. This research analyzes 110 related patents. The ontology me...

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Bibliographic Details
Main Authors: Shih-Min Hsu, 許世民
Other Authors: Ming-Jong Tsai
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/f929x3