| Summary: | 碩士 === 國立臺灣大學 === 機械工程學研究所 === 95 === In recent years, the electronic devices and components have better performance constantly. With the increasing performance, the heat generation of the electronic devices and components also increases. It frequently needs to increase those numbers of total fin areas and heat pipes , and leads the lower efficiency of manufacture by raising quality control time. Therefore, looking for rapid quality control method plays an important role. The main purpose of the research presented is to study the dynamic behavior of the electronic cooling module by using system identify method. There are four main points in the research : (1) The dynamic system identify of the electronic cooling module. (2) Observing the dynamic response of the electronic cooling module by proving two step input single. (3) The analysis of the heat pipe under drying out situation. (4) Establish the rapid quality control method. From the system identify results, the investigation successfully establishs the dynamic model for the electronic cooling module and improves the thermal interface resistance’problem by using the constant temperature heating device. By the transient behavior test in thirty seconds , it can forecast the steady performance of the electronic cooling module for establishing rapid quality control method.
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