Dummy Metal Insertion Based on Density Gradient Minimization with Coupling Constraints
碩士 === 國立臺灣大學 === 電子工程學研究所 === 95 === As IC process geometries shrink to 65nm and below, the post-CMP dielectric thickness variation control becomes a dominant technique for manufacturability. To improve CMP quality and enhance the yield, layout uniformity is necessary. Dummy metal insertion is a ge...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89134200887122922118 |