Analysis of Microstructure Evolution of RF Sputtered Ti1(subscript -x)Al(subscript x)N Affected by Intermediate Layer and Heat Treatment

Analysis of Microstructure Evolution of RF Sputtered Ti1(subscript -x)Al(subscript x)N Affected by Intermediate Layer and Heat Treatment

碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 95 === In this investigation, the two different hard protective thin film structures: TiAlN/Si&WC and TiAlN/AlN/Si&WC are deposited by RF sputtering system. The advantages of sputtering system is lower surface roughness, higher adhesion and more precise in f...

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Bibliographic Details
Main Authors:	Liu, Iu-Hsien, 劉祐銜
Other Authors:	楊哲人
Format:	Others
Language:	en_US
Published:	2007
Online Access:	http://ndltd.ncl.edu.tw/handle/00580715575925600020

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