Thermal Optimal Design for Compact Cold Plates in Electronics Cooling Applications

• Main Authors: PO-LI CHEN, 陳柏荔
• Other Authors: YING-HUEI HUNG
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/13561421757991613673

博士 === 國立清華大學 === 動力機械工程學系 === 95 === A series of thermal analyses with an effective thermal network method on heat transfer and flow friction characteristics of compact cold plates with discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure have been performed. Comparisons between the predicted thermal performance of discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure without or with compact cold plates by the present developed thermal analyzer and existing data have been made with satisfactory agreements. A series of parametric studies on thermal performance for discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure without and with compact cold plates have been explored, respectively. In addition, a systematical design optimization method with the Response Surface Methodology and Sequential Quadratic Programming techniques for performing the thermal optimization of compact cold plates with discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure under multiple constraints has been successfully developed. First, a statistical method for the sensitivity analysis has been performed to determine the critical factors of the design; and a response surface methodology has been applied to establish a series of performance correlations in terms of the design factors with a well-organized design of experiments. By employing the gradient-based numerical optimization technique, a series of globally optimal designs have been efficiently performed. With the developed design optimization method, two applications for thermal optimization of compact cold plates with discrete two-dimensional/three- dimensional electronic packages mounted on a multi-layer structure under multiple constraints have been systematically explored. They are (1) thermal optimal design for compact cold plates in CPU cooling and (2) thermal optimal design for compact cold plates in multi-layer PCB cooling. Furthermore, two novel interactive and user-friendly thermal optimal computer-aided design systems, which are composed of pre-processor, thermal network analyzer, optimizer, post-processor and user interface for automatically predicting the optimal thermal performance for generalized compact cold plates in CPU cooling and in multi-layer PCB cooling have been successfully developed. In the pre-processor, a user-friendly interface has been constructed to collect the required data for the thermal analyzer and optimizer. A thermal analyzer for compact cold plates with discrete two-dimensional/three-dimensional electronic packages mounted on a multi-layer structure has been successfully established by using an effective thermal network method. Corresponding to the presented design optimization method, the design optimizer has been established with the functions of conducting the design of experiments, automatically constructing response surface models, and then performing numerical optimization. After obtaining the optimal design, the real-time three-dimensional model, predicted color isotherms, and all the predicted performances have been displayed in the developed post-processor to provide a direct communication between user and computer. With the present developed thermal optimal computer-aided design systems, the optimal thermal design applied to generalized compact cold plates under multiple constraints with either a minimum thermal resistance or a minimum pressure drop/mass in CPU cooling and in multi-layer PCB cooling have been effectively performed. The superiority of the developed thermal optimal computer-aided design systems has been demonstrated.