The Structure Design for Thermal Shock Test of High Luminance Backlight Module

• Main Authors: Kuan-tun Chen, 陳冠端
• Other Authors: Chi-Hui Chien
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/ewxbj5

碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 95 === LCD products is becoming skillful and popular in recent years, and its components are also developing vigorously. Many manufactures are attracted to join backlight module business due to its lowest doorsill and highest cost proportion. However, the relative researches corresponding to backlight module focus on the uniformity, light guide plate and diffusion sheet, or the gain of brightness. There is not much study in highest brightness backlight module fixing and structure coaptation. This study will focus on the analysis of light guide plate fixing and structure coaptation. With thermal shock the variations of relative parameters of light guide plate and other components in different condition were observed. Then, the design parameters of components can be modified. The structure difference between backlight module and high brightness backlight module was discussed, and suggestions according to this experiment were proposed.