The settling behavior of chemical reduction and precipitation sludge from Cr(Ⅵ)-containing TFT-LCD etching wastewater

碩士 === 國立屏東科技大學 === 環境工程與科學系所 === 95 === In Taiwan, Cr(Ⅵ)–containing wastewater produced from etching process of TFT-LCD manufactures was usually treated by chemical reduction/ precipitation method. However it was found that the settling time of precipitates was very long. The objective of this rese...

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Main Authors: Guang-Tze Liou, 劉廣澤
Other Authors: Kuei-Jyum Yeh
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/02762537885876654459
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spelling ndltd-TW-095NPUS55150082016-12-22T04:11:52Z http://ndltd.ncl.edu.tw/handle/02762537885876654459 The settling behavior of chemical reduction and precipitation sludge from Cr(Ⅵ)-containing TFT-LCD etching wastewater TFT-LCD含鉻蝕刻廢液化學還原沈澱污泥沈降行為之探討 Guang-Tze Liou 劉廣澤 碩士 國立屏東科技大學 環境工程與科學系所 95 In Taiwan, Cr(Ⅵ)–containing wastewater produced from etching process of TFT-LCD manufactures was usually treated by chemical reduction/ precipitation method. However it was found that the settling time of precipitates was very long. The objective of this research was to characterize the settling behavior of chemical reduction/precipitation sludge of TFT-LCD etching wastewater. The results showed that the sludge settling behavior was type IV (compressed settling). The sludge from a simulated Ce(IV) wastewater exhibited a settling pattern similar to that of TFT-LCD sludge. On the ther hand, the sludge settling behavior of a simulated Cr(Ⅵ) solution was characterize as type III. These results revealed that when using chemical reduction/precipitation procedure to treat TFT-LCD etching wastewater, the Ce ion in the wastewater was simultaneously reduced and settled, resulting in an adverse settling effect. Moreover, nitric acid, another major ingredient of the etching wastewater, would also cause slightly negative effect on the settling of the chemical reduction/precipitation sludge. Nevertheless, Cr(Ⅵ) removal was not affected by the presence of Ce(Ⅳ) in the wastewater. By the dilution of 1/10, the settling of etching wastewater sludge was shifted to zone settling, and the sludge settling speeded up significantly. Similar results were obtained for simulated Ce(Ⅳ) solutions at lower concentrations (36 mM、91 mM、182 mM、274 mM). For the sludge produced from 36-182 mM of Ce(Ⅳ) solutions, the settling was characterized as zone settling (type Ⅲ) before 6 hrs, and a compressed settling (type IV) was found afterward. At higher concentrations (274 and 364 mM), Ce(Ⅳ) sludge exhibited a compressed settling for the entire settling period. The particle diameter and SEM analyses showed that the average particle diameter of Ce(Ⅳ) sludge was smaller at higher Ce(Ⅳ) concentrations. The SEM images also showed that the sludge particles for high concentrations of Ce(Ⅳ) solutions was small, solid and compact, without extensive compression, the Ce(Ⅳ) sludge of lower concentrations looked flaky, porous and large. Kuei-Jyum Yeh Ting-Chien Chen 葉桂君 陳庭堅 2007 學位論文 ; thesis 73 zh-TW
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language zh-TW
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description 碩士 === 國立屏東科技大學 === 環境工程與科學系所 === 95 === In Taiwan, Cr(Ⅵ)–containing wastewater produced from etching process of TFT-LCD manufactures was usually treated by chemical reduction/ precipitation method. However it was found that the settling time of precipitates was very long. The objective of this research was to characterize the settling behavior of chemical reduction/precipitation sludge of TFT-LCD etching wastewater. The results showed that the sludge settling behavior was type IV (compressed settling). The sludge from a simulated Ce(IV) wastewater exhibited a settling pattern similar to that of TFT-LCD sludge. On the ther hand, the sludge settling behavior of a simulated Cr(Ⅵ) solution was characterize as type III. These results revealed that when using chemical reduction/precipitation procedure to treat TFT-LCD etching wastewater, the Ce ion in the wastewater was simultaneously reduced and settled, resulting in an adverse settling effect. Moreover, nitric acid, another major ingredient of the etching wastewater, would also cause slightly negative effect on the settling of the chemical reduction/precipitation sludge. Nevertheless, Cr(Ⅵ) removal was not affected by the presence of Ce(Ⅳ) in the wastewater. By the dilution of 1/10, the settling of etching wastewater sludge was shifted to zone settling, and the sludge settling speeded up significantly. Similar results were obtained for simulated Ce(Ⅳ) solutions at lower concentrations (36 mM、91 mM、182 mM、274 mM). For the sludge produced from 36-182 mM of Ce(Ⅳ) solutions, the settling was characterized as zone settling (type Ⅲ) before 6 hrs, and a compressed settling (type IV) was found afterward. At higher concentrations (274 and 364 mM), Ce(Ⅳ) sludge exhibited a compressed settling for the entire settling period. The particle diameter and SEM analyses showed that the average particle diameter of Ce(Ⅳ) sludge was smaller at higher Ce(Ⅳ) concentrations. The SEM images also showed that the sludge particles for high concentrations of Ce(Ⅳ) solutions was small, solid and compact, without extensive compression, the Ce(Ⅳ) sludge of lower concentrations looked flaky, porous and large.
author2 Kuei-Jyum Yeh
author_facet Kuei-Jyum Yeh
Guang-Tze Liou
劉廣澤
author Guang-Tze Liou
劉廣澤
spellingShingle Guang-Tze Liou
劉廣澤
The settling behavior of chemical reduction and precipitation sludge from Cr(Ⅵ)-containing TFT-LCD etching wastewater
author_sort Guang-Tze Liou
title The settling behavior of chemical reduction and precipitation sludge from Cr(Ⅵ)-containing TFT-LCD etching wastewater
title_short The settling behavior of chemical reduction and precipitation sludge from Cr(Ⅵ)-containing TFT-LCD etching wastewater
title_full The settling behavior of chemical reduction and precipitation sludge from Cr(Ⅵ)-containing TFT-LCD etching wastewater
title_fullStr The settling behavior of chemical reduction and precipitation sludge from Cr(Ⅵ)-containing TFT-LCD etching wastewater
title_full_unstemmed The settling behavior of chemical reduction and precipitation sludge from Cr(Ⅵ)-containing TFT-LCD etching wastewater
title_sort settling behavior of chemical reduction and precipitation sludge from cr(ⅵ)-containing tft-lcd etching wastewater
publishDate 2007
url http://ndltd.ncl.edu.tw/handle/02762537885876654459
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