| Summary: | 碩士 === 國立屏東科技大學 === 環境工程與科學系所 === 95 === There are two streams of waste nitric acid liquid solution from the manufacturing processes in the Printed Circuit Board (PCB) factory, one’s main metal ion composition is copper, and the other is mainly composed of copper and tin ion.
The real waste acid liquid was used to study the copper reclamation from the first or primary waste stream by adding the sulfuric acid into this solution of copper nitrate. The simulated solutions were used to study the metal ion precipitation sequences, the potential metal separation, metal reclamation, and the feasibility of sulfuric acid replacement technique for the secondary waste stream.
The results showed that the higher the concentration of nitrate ion was, the more easily the metal ion reacted with added sulfuric acid and generated the precipitation. The metal ions could be separated most easily in 45% nitrate solution. The metal ion precipitation sequences were lead, iron, zinc, and copper ion. The copper ion could only be reclaimed from 71% nitrate solution and copper ion concentration was high enough.
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