Analysis Effective the factors of Adhesion Forceon Semiconductor Encapsulation Mold
碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 95 === In semiconductor engineering IC packaging, when compound (CPD) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. Many param...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86877872789608132150 |