The Application of Heat-Exchange Power-Saving Technique to the IC-Package Cleaning Machine

碩士 === 國立彰化師範大學 === 電機工程學系 === 95 === Clean process is widely used in IC assembly industry. Normally, the volume of the input water of the clean machine is about 3~5 gallon per minute and the temperature is about 82 degree Centigrade. The electricity power consumption of the heater of the clean mach...

Full description

Bibliographic Details
Main Author: 林志峰
Other Authors: 魏忠必
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/80510418044435615603
Description
Summary:碩士 === 國立彰化師範大學 === 電機工程學系 === 95 === Clean process is widely used in IC assembly industry. Normally, the volume of the input water of the clean machine is about 3~5 gallon per minute and the temperature is about 82 degree Centigrade. The electricity power consumption of the heater of the clean machine occupies the whole electricity energy more than 80%. The key factor to cause the high energy request is the heating cost (by electricity or gas). The average power consumption is 140 kwhr and equal to NTD$ 224/HR. In order to reduce the heating cost, we will focus on study of the hot wafer recycle at the clean operation of IC assembly process. The hot water recycle system used a heat converter to retrieve the heat energy from the exit of the hot water of the IC clean machine. In the open reccyle system, the energy can be used for heat the new coming water and reduce the energy waste on pre-heating water. The reduction of 35% power consumption is accomplished by this study. For 4 clean machines in the Flip Chip Technonogy Company, 3,430,000 NT$ can be saved per year. Besides, it gets the good cost feedback within 4 months.