Silicon Nitride to Silicon Nitride Bonding
碩士 === 國立中央大學 === 機械工程研究所 === 95 === Wafer bonding is a novel technology to bond two different wafers by no any adhesive layer. Various methods have been developed such as chemical activaion, anodic bonding, plasma activation, vacum bonding, etc. Even this, we still cannot get strongly bonding stren...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91503677586555418622 |