| Summary: | 碩士 === 國立中央大學 === 工業管理研究所 === 95 === In recent years, semiconductor manufacturing (SM) companies enthusiastically establish 300-mm fabs. However, establishing a new SM facility needs at least multi-billion US dollars. With the limited area in Taiwan, large footprints not only pose constraints for the facility designer but present challenge in the design of automatic material handling system (AMHS). SM is a highly sophiscated operation with various processes to be performed, and SM factories typically have reentrant flow to introduce the incresed number of process steps. In response to such challenge, it has become necessary to eliminate the manual handling of the wafers. As a result, facility layout design and AMHS are two major aspects to achieve a sucessful 300-mm fab.
The purpose of the optimazation of material transport is to reduce cycle time, work in process (WIP), delivery time, and increase yield. Therefore, the approach attepmpted to incorporate facility layout and AMHS simulataneously has become a critical factor on factory operation.
This paper focuses on using the integrated fab layout to achieve a short transportation distance of interbay by employing heuristic algorithm and mathematical programming model. In addition, this paper proposes this two-stage procedure can obtain a good quality solution. Based on this analysis, effective facility layout is shown to reduce tansportation distance of wafer lots, and increase equipment utility. This pape will mainly aimed double-loop configuration(which is blend spine-configuration with Perimeter-configuration) facility layout problem.
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