| Summary: | 碩士 === 國立交通大學 === 管理學院碩士在職專班管理科學組 === 95 === Lithography is the most key one technology in the IC production, it determine the advanced degree in the whole process. In the current lithography process, because of the difference among each tool, so we can usually see that Critical Layer has the restrictions of Single Tool or Grouping to avoid Offset between tools that result in overlay or energy shift.
In order to reduce the skew among Layer, especially relatively Layer of Critical, knows the restriction to process on the same tool (Single Tool Constrain), in order to increase process’s stability degree. The restriction makes lithography machines of Bottleneck already, seem more difficult and more complicated on planning of production operation.
In Production planning field and Papers of IEEE, many of dispatching rules were developed to satisfy this kind of restriction. Such as: Family-based, Starvation Avoidance (Glassey and Petrakian, SA) , FIFO, EDD, SRPT…etc.
But present ways are all developed with the constrains of (Single Tool Constrain), and unable to really solve the problem.
The Paper combined several process and manufacturing control system, using multi-variables weighting algorithm to solve single-tool-restrain problem voluntarily. And then using intelligent agent method to develop the software, building and constructing model and system actually, solving process and dispatch problem semiconductor’s company met actually.
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