Investigation of Electrical Properties and Reliabilities of Chip-on-Glass（COG）with Compliant Bumps
碩士 === 國立交通大學 === 材料科學與工程系所 === 95 === Non conductive film（NCF）is widely adopted by flat panel display（FPD）industry in chip-on-glass（COG）bonding method it provides low processing temperature and low product cost. As revealed by four-point test, the contact resistances of bumps subjected to six therm...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/63069413656528339922 |