Fabrication and characterization of light emitting diode package using Ultra-Small-Package substrate

• Main Authors: Chau-Shiung Chang, 張超雄
• Other Authors: Wei-Jr Lai
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/74759338745419027960

碩士 === 國立成功大學 === 光電科學與工程研究所 === 95 === In the thesis, we focus on the development of substrate and compound and the characteristic of reliability in the process of LED package typed SMD. The substrate used most, in the process of LED package typed SMD, is Print Circuit Board (PCB). The thickness of thinned LED typed SMD approaching the limit is around 0.3mm in the current market, and the life- time and the characteristic will be influenced in further thinning as a result of the leakage of wire. The Ultra Small Package (USP) cited in the thesis not only thins the thickness but lifts the life-time up. On the other hand, we choose three different kinds of molding compound and try out the condition of optimization allowing stable manufacture. While the reliability is relevant to the temperature, in this thesis it will be an important issue whether USP is resistible from the destroying of thermal strain derived from circulation and impact of temperature. Keywords: surface-mount device, light emitting diode, Printed circuit board